Rigid-Flex PCBS

Current Capabilities

  • RoHs Compliant FR-4
  • Up to 12 layers Rigid-Flex
  • Adhesiveless base
  • Thin-core FR4
  • Shielding Copper, Silver ink
  • Flex with rigidizer P.I., FR4, Metal
  • Flex with dimples
  • QS9002, ISO9002, UL
  • Pre-formed Flex
  • Flex with Impedance control
  • Line-width/Spacing 3 mil/3mil
  • Layer to Layer ± 5mil
  • Minimum hole size .006″
  • Copper thickness 1/4 oz min
  • Panel Size 20″ x 24″
  • Adhesiveless Material
  • Cover P.I. P.I.C. Flexible Solder Mask
  • Finishing Hard Soft Immersion Gold
  • Tin/Lead
  • Outline to outline dimension ± 3mil
  • Punched hole to outline dimension ± 3mil
  • Drilled hole to outline dimension ± 6mil
  • ±10% Impedance Tolerance
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See Rigid PCBs
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See Panelization Support