Rigid PCBS

Materials

  • RoHs Compliant FR-4
  • High Temp FR4
  • Halogen Free
  • Metal Based
  • PTFE
  • Bergquist
  • Rogers
  • Taconic
  • Getek
  • Isola
  • Megtron

Surface Finish

  • Lead Free Solder
  • Immersion Gold
  • Immersion Tin
  • Immersion Silver
  • O.S.P. (Entek 106HT)
  • Carbon Ink
  • Full Body Gold
  • ENEPIG
  • Selective Surface Finish Combinations

Current Capabilities

Copper
  • Up to 8oz. external
  • Up to 6 oz. internal
Min/Max Board Thickness
  • 0.010 to 0.500
Metal Based
  • Up to 44 Layers From Prototypes to Mass Production.
Hole Aspect Ratio
  • Up to 12:1
Minimum Pitch
  • SMT - 0.010
  • BGA Ball - 0.016
Minimum Hole Size
  • Mechanical 0.006
  • Laser 0.003
Minimum Line/Space
  • External 0.003/0.003
  • Internal 2.5/2.5
Impedance Control
  • ±10% Tolerance: Standard
  • ±5% Tolerance: Advanced
Maximum Board Size
  • Double sided 24″ X 28″
  • Multilayer 24″ X 28″

Special Process

  • Via hole filling with conductive & Non-conductive
  • Plasma Etch Back
  • Counter Sink
  • Edge Plating
  • Counter Bore
  • Milling

Special Technologies

  • Blind Vias
  • Buried Vias
  • HDI
  • Stacked Micro Vias
  • BGA
  • Via-In-Pad

Depanelization

  • V-Scoring
  • Routing
  • Laser

Certifications

  • UL Approved
  • ISO9001-2015
  • ISO14001
  • ISO/TS16949
  • AS9100C
  • ISO-13485
  • REACH

Solder Mask

  • Taiyo LPI (Available in all colors)
  • Immersion Tin
  • Tamura (Available in several colors)
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See PCB Layout/Design
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See Rigid-Flex PCBs