Materials
- RoHs Compliant FR-4
- High Temp FR4
- Halogen Free
- Metal Based
- PTFE
- Bergquist
- Rogers
- Taconic
- Getek
- Isola
- Megtron
Surface Finish
- Lead Free Solder
- Immersion Gold
- Immersion Tin
- Immersion Silver
- O.S.P. (Entek 106HT)
- Carbon Ink
- Full Body Gold
- ENEPIG
- Selective Surface Finish Combinations
Current Capabilities
Copper
- Up to 8oz. external
- Up to 6 oz. internal
Min/Max Board Thickness
- 0.010 to 0.500
Metal Based
- Up to 44 Layers From Prototypes to Mass Production.
Hole Aspect Ratio
- Up to 12:1
Minimum Pitch
- SMT - 0.010
- BGA Ball - 0.016
Minimum Hole Size
- Mechanical 0.006
- Laser 0.003
Minimum Line/Space
- External 0.003/0.003
- Internal 2.5/2.5
Impedance Control
- ±10% Tolerance: Standard
- ±5% Tolerance: Advanced
Maximum Board Size
- Double sided 24″ X 28″
- Multilayer 24″ X 28″
Special Process
- Via hole filling with conductive & Non-conductive
- Plasma Etch Back
- Counter Sink
- Edge Plating
- Counter Bore
- Milling
Special Technologies
- Blind Vias
- Buried Vias
- HDI
- Stacked Micro Vias
- BGA
- Via-In-Pad
Depanelization
- V-Scoring
- Routing
- Laser
Certifications
- UL Approved
- ISO9001-2015
- ISO14001
- ISO/TS16949
- AS9100C
- ISO-13485
- REACH
Solder Mask
- Taiyo LPI (Available in all colors)
- Immersion Tin
- Tamura (Available in several colors)
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See Rigid-Flex PCBs
